Laser processing of slots and holes

ABSTRACT

The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO 2  laser beam to promote full separation about the perforated line.

RELATED APPLICATION(S)

This application claims the benefit of U.S. Provisional Application No.61/917,148 filed on Dec. 17, 2013 and U.S. Provisional Application No.62/022,855 filed on Jul. 10, 2014. The entire teachings of theseapplications are incorporated herein by reference.

BACKGROUND

The cutting of holes and slots in thin substrates of transparentmaterials, such as glass, can be accomplished by focused laser beamsthat are used to ablate material along the contour of a hole or slot,where multiple passes are used to remove layer after layer of materialuntil the inner plug no longer is attached to the outer substrate piece.The problem with such processes is that they require many passes (dozensor even more) of the laser beam to remove the material layer by layer,they generate significant ablative debris which will contaminate thesurfaces of the part, and they generate a lot of subsurface damage (>100μm) along the edge of the contour.

Therefore, there is a need for an improved process for cutting holes andslots.

SUMMARY

Embodiments described herein relate to a process for cutting andseparating interior contours in thin substrates of transparentmaterials, in particular glass.

In one embodiment, a method of laser drilling a material includesfocusing a pulsed laser beam into a laser beam focal line, viewed alongthe beam propagation direction, directing the laser beam focal line intothe material at a first location, the laser beam focal line generatingan induced absorption within the material, the induced absorptionproducing a hole along the laser beam focal line within the material,translating the material and the pulsed laser beam relative to eachother starting from the first location along a first closed contour,thereby laser drilling a plurality of holes along the first closedcontour within the material, translating the material and the pulsedlaser beam relative to each other starting from the first location alonga first closed contour, thereby laser drilling a plurality of holesalong the first closed contour within the material, and directing acarbon dioxide (CO2) laser into the material around a second closedcontour contained within the first closed contour to facilitate removalof an inner plug of the material along the first closed contour.

BRIEF DESCRIPTION OF THE DRAWINGS

The patent or application file contains at least one drawing executed incolor. Copies of this patent or patent application publication withcolor drawing(s) will be provided by the Office upon request and paymentof the necessary fee.

The foregoing will be apparent from the following more particulardescription of example embodiments of the invention, as illustrated inthe accompanying drawings in which like reference characters refer tothe same parts throughout the different views. The drawings are notnecessarily to scale, emphasis instead being placed upon illustratingembodiments of the present invention.

FIG. 1 is an illustration of a part to be cut out of a starting sheet.The part has both outer and inner contours. The outer contour can beeasily released from the mother sheet by adding in additional cuts or“release lines.”

FIGS. 2A and 2B are illustrations of positioning of the laser beam focalline, i.e., the processing of a material transparent for the laserwavelength due to the induced absorption along the focal line.

FIG. 3A is an illustration of an optical assembly for laser drilling.

FIG. 3B-1 thru 3B-4 is an illustration of various possibilities toprocess the substrate by differently positioning the laser beam focalline relative to the substrate.

FIG. 4 is an illustration of a second optical assembly for laserdrilling.

FIGS. 5A and 5B are illustrations of a third optical assembly for laserdrilling.

FIG. 6 is a schematic illustration of a fourth optical assembly forlaser drilling.

FIG. 7A-7C is an illustration of different regimes for laser processingof materials. FIG. 7A illustrates an unfocused laser beam, FIG. 7Billustrates a condensed laser beam with a spherical lens, and FIG. 7Cillustrates a condensed laser beam with an axicon or diffractive Fresnellens.

FIG. 8A illustrates schematically the relative intensity of laser pulseswithin an exemplary pulse burst vs. time, with each exemplary pulseburst having 3 pulses.

FIG. 8B illustrates schematically relative intensity of laser pulses vs.time within an exemplary pulse burst, with each exemplary pulse burstcontaining 5 pulses.

FIG. 8C is a description of different laser steps and paths traced outto define an inner contour and remove the material inside this contour.

FIG. 9 is a description of the CO₂ laser step and path traced out toremove the material inside the contour.

FIG. 10 is an example of a hole and slot cut and then separated from a0.7 mm thick sample. The hole and slot were cut and removed using theprocess according to this invention.

FIG. 11 is an angled image of the interior edge of a slot formed withthe process described herein, after the CO₂ ablation process has beenused to remove the interior material.

FIG. 12 is an edge image of a straight cut strip of 0.7 mm thick Corning2320 NIOX (not ion exchanged) thick substrate, an exterior contour. Thisedge can be compared to the very similar edge shown in FIG. 11.

FIG. 13 is a top view of a cut edge of a slot made with the processdescribed herein. No chipping or checking is observed on the edge of thecontour. This contour has a radius of about 2 mm.

FIGS. 14A-14C are illustrations of a fault line (or perforated line)with equally spaced defect lines or damage tracks of modified glass.

DETAILED DESCRIPTION

A description of example embodiments follows.

Disclosed herein is a process for cutting and separating interiorcontours in thin substrates of transparent materials, in particularglass. The method involves the utilization of an ultra-short pulse laserto form perforation or holes in the substrate, that may be followed byuse of a CO₂ laser beam to promote full separation about the perforatedline. The laser process described below generates full body cuts of avariety of glasses in a single pass, with low sub-surface damage (<75μm), and excellent surface roughness (Ra<0.5 um). Sub-surface damage(SSD) is defined as the extent of cracks or “checks” perpendicular tothe cut edge of the glass piece. The magnitude of the distance thesecracks extend into the glass piece can determine the amount of latermaterial removal that may be needed from grinding and polishingoperations that are used to improve glass edge strength. SSD may bemeasured by using confocal microscope to observed light scattering fromthe cracks, and determining the maximum distance the cracks extend intothe body of the glass over a given cut edge.

One embodiment relates a method to cut and separate interior contours inmaterials such as glass, with a separation process that exposes the highquality edge generated by the above-mentioned perforation processwithout damaging it by the separation process. When a part is cut out ofa starting sheet of substrate, it may be comprised of outer or innercontours, as shown in FIG. 1. Release of outer contour the part from thesheet can be done by adding additional cut lines known as “releaselines”, as shown in FIG. 1. However, for the interior contours, norelease lines can be made, as they would mar the part of interest. Insome cases, for the highly stressed materials and large enough interiorcontours, the inner part may self-separate and fall out. However, forsmall holes and slots (e.g., 10 mm holes, slots of widths <few mm, forexample ≦3 mm, or <2 mm, or even <1 mm), even for stressed materials,the inner part will not fall out. A hole is generally defined as acircular, or substantially circular feature in crossection. In contrast,slots are generally have highly elliptical features, such as featuresthat have aspect ratios (e.g., cross-sectional or as viewed from the topor bottom, for example) of length to width of >4:1, typically ≧5:1, forexample 1.5 mm×15 mm, or 3 mm×15 mm, or 1 mm×10 mm, or 1.5 mm by 7 mm,etc. Slots may have radiused corners, or the corners may be sharp (90degree) features.

The challenge with separating an interior contour, such as a hole in aglass piece required for the “home” or power button on a smart phone, isthat even if the contour is well perforated and a crack propagatesaround it, the inner plug of material may be under compressive pressureand locked in place by the material surrounding the plug. This meansthat the challenging part is an automated release process that allowsthe plug to drop out. This problem occurs regardless of whether or notthe material to be cut is high stress and easy to form cracks in, likein the case of a chemically strengthened glass substrate like Gorilla®Glass, or if the material is low stress, like in the case of Eagle XG®glass. A high stress glass is a glass having central (in the center ofthe thickness of the glass) tension greater than about 24 MPa; while alow stress glass typically has a central tension less than about 24 MPa.

The present application is generally directed to a laser method andapparatus for precision cutting and separation of arbitrary shapes outof glass substrates in a controllable fashion, with negligible debrisand minimum damage to part edges that preserves strength. The developedlaser method relies on the material transparency to the laser wavelengthin linear regime, or low laser intensity, which allows maintenance of aclean and pristine surface quality and on the reduced subsurface damagecreated by the area of high intensity around the laser focus. One of thekey enablers of this process is the high aspect ratio of the defectcreated by the ultra-short pulsed laser. It allows creation of a faultline that extends from the top to the bottom surfaces of the material tobe cut. In principle, this defect can be created by a single laser pulseand if necessary, additional pulses can be used to increase theextension of the affected area (depth and width).

Using a short pulse picosecond laser and optics which generate a focalline, a closed contour is perforated in a glass sheet. The perforationsare less than a few microns in diameter, typical spacing of theperforations is 1-15 μm, and the perforations go entirely through theglass sheet.

To generate a weak point to facilitate material removal, an additionalcontour could then be optionally perforated with the same process a fewhundred microns to the interior of the first contour.

A focused CO₂ laser beam, of a high enough power density to ablate theglass material, is then traced around the second contour, causing theglass material to fragment and be removed. One or more passes of thelaser may be used. A high pressure assist gas is also forced out througha nozzle collinearly to the CO₂ beam, to provide additional force todrive the glass material out of the larger glass piece.

The method to cut and separate transparent materials is essentiallybased on creating a fault line on the material to be processed with anultra-short pulsed laser. Depending on the material properties(absorption, CTE, stress, composition, etc.) and laser parameters chosenfor processing that determined material, the creation of a fault linealone can be enough to induce self-separation. This is the case for moststrengthened glasses (those that have already undergone ion-exchangebefore cutting) that have significant (i.e., greater than about 24 MPa)internal or central tension (CT). In this case, no secondary separationprocesses, such as tension/bending forces or CO₂ laser, are necessary.

In some cases, the created fault line is not enough to separate theglass automatically. This is often the case for display glasses such asEagle XG®, Lotus, or ion-exchangeable glasses that are cut before anyion-exchange step. Thus, a secondary process step may be necessary. Ifso desired, a second laser can be used to create thermal stress toseparate it, for example. In the case of Corning code 2320 NIOX (non-ionexchanged Gorilla® Glass 3), we have found that separation can beachieved, after the creation of a defect line, by application ofmechanical force or by tracing the existing fault line with an infraredCO₂ laser beam to create thermal stress and force the parts toself-separate. Another option is to have the CO₂ laser only start theseparation and finish the separation manually. The optional CO₂ laserseparation is achieved with a defocused (i.e. spot size at the glass of2-12 mm in diameter) continuous wave laser emitting at 10.6 μm and withpower adjusted by controlling its duty cycle. Focus change (i.e., extentof defocusing) is used to vary the induced thermal stress by varying thespot size. After generation of the perforation lines, CO₂ inducedseparation can generally be achieved by using a power at the glass of˜40 W, a spot size of about 2 mm, and a traverse rate of the beam of˜14-20 m/minute.

However, even if the glass has enough internal stress to startself-separation after the formation of the defect line, the geometry ofthe cut contour may prevent an interior glass part from releasing. Thisis the case for most closed or inner contours, such as simple holes orslots. The interior portion of the aperture will remain in place due tothe compression forces present in the glass sheet—the cracks maypropagate between the perforated defects, but no room exists to allowthe piece to fall out of the mother sheet.

Forming the Defect or Perforation Line

For the first process step, there are several methods to create thatdefect line. The optical method of forming the line focus can takemultiple forms, using donut shaped laser beams and spherical lenses,axicon lenses, diffractive elements, or other methods to form the linearregion of high intensity. The type of laser (picosecond, femtosecond,etc.) and wavelength (IR, green, UV, etc.) can also be varied, as longas sufficient optical intensities are reached to create breakdown of thesubstrate material. This wavelength may be, for example, 1064, 532, 355or 266 nanometers.

Ultra-short pulse lasers can be used in combination with optics thatgenerate a focal line to fully perforate the body of a range of glasscompositions. In some embodiments, the pulse duration of the individualpulses is in a range of between greater than about 1 picoseconds andless than about 100 picoseconds, such as greater than about 5picoseconds and less than about 20 picoseconds, and the repetition rateof the individual pulses can be in a range of between about 1 kHz and 4MHz, such as in a range of between about 10 kHz and 650 kHz.

In addition to a single pulse operation at the aforementioned individualpulse repetition rates, the pulses can be produced in bursts of twopulses, or more (such as, for example, 3 pulses, 4, pulses, 5 pulses, 10pulses, 15 pulses, 20 pulses, or more) separated by a duration betweenthe individual pulses within the pulse burst that is in a range ofbetween about 1 nsec and about 50 nsec, for example, 10-50 nsec, or 10to 30 nsec, such as about 20 nsec, and the burst repetition frequencycan be in a range of between about 1 kHz and about 200 kHz. (Bursting orproducing pulse bursts is a type of laser operation where the emissionof pulses is not in a uniform and steady stream but rather in tightclusters of pulses.) The pulse burst laser beam can have a wavelengthselected such that the material is substantially transparent at thiswavelength. The average laser power per burst measured at the materialcan be greater than 40 microJoules per mm thickness of material, forexample between 40 microJoules/mm and 2500 microJoules/mm, or between200 and 800 microJoules/mm. For example, for 0.5 mm-0.7 mm thick Corning2320 non-ion exchanged glass one may use 200 μJ pulse bursts to cut andseparate the glass, which gives an exemplary range of 285-400 μJ/mm. Theglass is moved relative to the laser beam (or the laser beam istranslated relative to the glass) to create perforated lines that traceout the shape of any desired parts.

The laser creates hole-like defect zones (or damage tracks, or defectlines) that penetrate the full depth the glass, with internal openings,for example of approximately 1 micron in diameter. These perforations,defect regions, damage tracks, or defect lines are generally spaced from1 to 15 microns apart (for example, 2-12 microns, or 3-10 microns). Thedefect lines extend, for example, through the thickness of the glasssheet, and are orthogonal to the major (flat) surfaces of the glasssheet.

In one embodiment, an ultra-short (˜10 psec) burst pulsed laser is usedto create this high aspect ratio vertical defect line in a consistent,controllable and repeatable manner. The detail of the optical setup thatenables the creation of this vertical defect line is described below andin U.S. Application No. 61/752,489, filed on Jan. 15, 2013. The essenceof this concept is to use an axicon lens element in an optical lensassembly to create a region of high aspect ratio taper-free microchannelusing ultra-short (picoseconds or femtosecond duration) Bessel beams. Inother words, the axicon condenses the laser beam into a region ofcylindrical shape and high aspect ratio (long length and smalldiameter). Due to the high intensity created with the condensed laserbeam, nonlinear interaction of the laser electromagnetic field and thematerial occurs and the laser energy is transferred to the substrate.However, it is important to realize that in the areas where the laserenergy intensity is not high (i.e., glass surface, glass volumesurrounding the central convergence line), nothing happens to the glassas the laser intensity is below the nonlinear threshold.

Turning to FIGS. 2A and 2B, a method of laser drilling a materialincludes focusing a pulsed laser beam 2 into a laser beam focal line 2b, viewed along the beam propagation direction. As shown in FIG. 3,laser 3 (not shown) emits laser beam 2, at the beam incidence side ofthe optical assembly 6 referred to as 2 a, which is incident on theoptical assembly 6. The optical assembly 6 turns the incident laser beaminto an extensive laser beam focal line 2 b on the output side over adefined expansion range along the beam direction (length l of the focalline). The planar substrate 1 to be processed is positioned in the beampath after the optical assembly overlapping at least partially the laserbeam focal line 2 b of laser beam 2. Reference 1 a designates thesurface of the planar substrate facing the optical assembly 6 or thelaser, respectively, reference 1 b designates the reverse surface ofsubstrate 1 usually spaced in parallel. The substrate thickness(measured perpendicularly to the planes 1 a and 1 b, i.e., to thesubstrate plane) is labeled with d.

As FIG. 2A depicts, substrate 1 is aligned perpendicularly to thelongitudinal beam axis and thus behind the same focal line 2 b producedby the optical assembly 6 (the substrate is perpendicular to the drawingplane) and viewed along the beam direction it is positioned relative tothe focal line 2 b in such a way that the focal line 2 b viewed in beamdirection starts before the surface 1 a of the substrate and stopsbefore the surface 1 b of the substrate, i.e. still within thesubstrate. In the overlapping area of the laser beam focal line 2 b withsubstrate 1, i.e. in the substrate material covered by focal line 2 b,the extensive laser beam focal line 2 b thus generates (in case of asuitable laser intensity along the laser beam focal line 2 b which isensured due to the focusing of laser beam 2 on a section of length l,i.e. a line focus of length l) an extensive section 2 c viewed along thelongitudinal beam direction, along which an induced absorption isgenerated in the substrate material which induces a defect line or crackformation in the substrate material along section 2 c. The crackformation is not only local, but over the entire length of the extensivesection 2 c of the induced absorption. The length of section 2 c (i.e.,after all, the length of the overlapping of laser beam focal line 2 bwith substrate 1) is labeled with reference L. The average diameter orthe average extension of the section of the induced absorption (or thesections in the material of substrate 1 undergoing the crack formation)is labeled with reference D. This average extension D basicallycorresponds to the average diameter δ of the laser beam focal line 2 b,that is, an average spot diameter in a range of between about 0.1 μm andabout 5 μm.

As FIG. 2A shows, substrate material transparent for the wavelength λ oflaser beam 2 is heated due to the induced absorption along the focalline 2 b. FIG. 2B outlines that the warming material will eventuallyexpand so that a correspondingly induced tension leads to micro-crackformation, with the tension being the highest at surface 1 a.

Concrete optical assemblies 6, which can be applied to generate thefocal line 2 b, as well as a concrete optical setup, in which theseoptical assemblies can be applied, are described below. All assembliesor setups are based on the description above so that identicalreferences are used for identical components or features or those whichare equal in their function. Therefore only the differences aredescribed below.

As the parting face eventually resulting in the separation is or must beof high quality (regarding breaking strength, geometric precision,roughness and avoidance of re-machining requirements), the individualfocal lines to be positioned on the substrate surface along parting line5 should be generated using the optical assembly described below(hereinafter, the optical assembly is alternatively also referred to aslaser optics). The roughness results particularly from the spot size orthe spot diameter of the focal line. In order to achieve a low spot sizeof, for example, 0.5 μm to 2 μm in case of a given wavelength λ of laser3 (interaction with the material of substrate 1), certain requirementsmust usually be imposed on the numerical aperture of laser optics 6.These requirements are met by laser optics 6 described below.

In order to achieve the required numerical aperture, the optics must, onthe one hand, dispose of the required opening for a given focal length,according to the known Abbé formulae (N.A.=n sin (theta), n: refractiveindex of the glass to be processes, theta: half the aperture angle; andtheta=arc tan (D/2f); D: aperture, f: focal length). On the other hand,the laser beam must illuminate the optics up to the required aperture,which is typically achieved by means of beam widening using wideningtelescopes between laser and focusing optics.

The spot size should not vary too strongly for the purpose of a uniforminteraction along the focal line. This can, for example, be ensured (seethe embodiment below) by illuminating the focusing optics only in asmall, circular area so that the beam opening and thus the percentage ofthe numerical aperture only vary slightly.

According to FIG. 3A (section perpendicular to the substrate plane atthe level of the central beam in the laser beam bundle of laserradiation 2; here, too, the center of the laser beam 2 is preferablyperpendicularly incident to the substrate plane, i.e. angle is 0° sothat the focal line 2 b or the extensive section of the inducedabsorption 2 c is parallel to the substrate normal), the laser radiation2 a emitted by laser 3 is first directed onto a circular aperture 8which is completely opaque for the laser radiation used. Aperture 8 isoriented perpendicular to the longitudinal beam axis and is centered onthe central beam of the depicted beam bundle 2 a. The diameter ofaperture 8 is selected in such a way that the beam bundles near thecenter of beam bundle 2 a or the central beam (here labeled with 2 aZ)hit the aperture and are completely absorbed by it. Only the beams inthe outer perimeter range of beam bundle 2 a (marginal rays, herelabeled with 2 aR) are not absorbed due to the reduced aperture sizecompared to the beam diameter, but pass aperture 8 laterally and hit themarginal areas of the focusing optic elements of the optical assembly 6,which is designed as a spherically cut, bi-convex lens 7 here.

Lens 7 centered on the central beam is deliberately designed as anon-corrected, bi-convex focusing lens in the form of a common,spherically cut lens. Put another way, the spherical aberration of sucha lens is deliberately used. As an alternative, aspheres or multi-lenssystems deviating from ideally corrected systems, which do not form anideal focal point but a distinct, elongated focal line of a definedlength, can also be used (i.e., lenses or systems which do not have asingle focal point). The zones of the lens thus focus along a focal line2 b, subject to the distance from the lens center. The diameter ofaperture 8 across the beam direction is approximately 90% of thediameter of the beam bundle (beam bundle diameter defined by theextension to the decrease to 1/e²) (intensity) and approximately 75% ofthe diameter of the lens of the optical assembly 6. The focal line 2 bof a non-aberration-corrected spherical lens 7 generated by blocking outthe beam bundles in the center is thus used. FIG. 3A shows the sectionin one plane through the central beam, the complete three-dimensionalbundle can be seen when the depicted beams are rotated around the focalline 2 b.

One disadvantage of this focal line is that the conditions (spot size,laser intensity) along the focal line, and thus along the desired depthin the material, vary and therefore the desired type of interaction (nomelting, induced absorption, thermal-plastic deformation up to crackformation) may possibly only be selected in a part of the focal line.This means in turn that possibly only a part of the incident laser lightis absorbed in the desired way. In this way, the efficiency of theprocess (required average laser power for the desired separation speed)is impaired on the one hand, and on the other hand the laser light mightbe transmitted into undesired deeper places (parts or layers adherent tothe substrate or the substrate holding fixture) and interact there in anundesirable way (heating, diffusion, absorption, unwanted modification).

FIG. 3B-1-4 show (not only for the optical assembly in FIG. 3A, butbasically also for any other applicable optical assembly 6) that thelaser beam focal line 2 b can be positioned differently by suitablypositioning and/or aligning the optical assembly 6 relative to substrate1 as well as by suitably selecting the parameters of the opticalassembly 6: As FIG. 3B-1 outlines, the length l of the focal line 2 bcan be adjusted in such a way that it exceeds the substrate thickness d(here by factor 2). If substrate 1 is placed (viewed in longitudinalbeam direction) centrally to focal line 2 b, an extensive section ofinduced absorption 2 c is generated over the entire substrate thickness.

In the case shown in FIG. 3B-2, a focal line 2 b is generated which hasa length l which is substantially the same as the substrate thickness d.As substrate 1 relative to line 2 is positioned in such a way that line2 b starts in a point before, i.e. outside the substrate, the length Lof the extensive section of induced absorption 2 c (which extends herefrom the substrate surface to a defined substrate depth, but not to thereverse surface 1 b) is smaller than the length l of focal line 2 b.FIG. 3B-3 shows the case in which the substrate 1 (viewed along the beamdirection) is partially positioned before the starting point of focalline 2 b so that, here too, it applies to the length l of line 2 b 1>L(L=extension of the section of induced absorption 2 c in substrate 1).The focal line thus starts within the substrate and extends over thereverse surface 1 b to beyond the substrate. FIG. 3B-4 finally shows thecase in which the generate focal line length l is smaller than thesubstrate thickness d so that—in case of a central positioning of thesubstrate relative to the focal line viewed in the direction ofincidence—the focal line starts near the surface 1 a within thesubstrate and ends near the surface 1 b within the substrate (l=0.75·d).

It is particularly advantageous to realize the focal line positioning insuch a way that at least one surface 1 a, 1 b is covered by the focalline, i.e. that the section of induced absorption 2 c starts at least onone surface. In this way it is possible to achieve virtually ideal cutsavoiding ablation, feathering and particulation at the surface.

FIG. 4 depicts another applicable optical assembly 6. The basicconstruction follows the one described in FIG. 3A so that only thedifferences are described below. The depicted optical assembly is basedupon the use of optics with a non-spherical free surface in order togenerate the focal line 2 b, which is shaped in such a way that a focalline of defined length l is formed. For this purpose, aspheres can beused as optic elements of the optical assembly 6. In FIG. 4, forexample, a so-called conical prism, also often referred to as axicon, isused. An axicon is a special, conically cut lens which forms a spotsource on a line along the optical axis (or transforms a laser beam intoa ring). The layout of such an axicon is principally known to one ofskill in the art; the cone angle in the example is 10°. The apex of theaxicon labeled here with reference 9 is directed towards the incidencedirection and centered on the beam center. As the focal line 2 b of theaxicon 9 already starts in its interior, substrate 1 (here alignedperpendicularly to the main beam axis) can be positioned in the beampath directly behind axicon 9. As FIG. 4 shows, it is also possible toshift substrate 1 along the beam direction due to the opticalcharacteristics of the axicon without leaving the range of focal line 2b. The extensive section of the induced absorption 2 c in the materialof substrate 1 therefore extends over the entire substrate thickness d.

However, the depicted layout is subject to the following restrictions:As the focal line of axicon 9 already starts within the lens, asignificant part of the laser energy is not focused into part 2 c offocal line 2 b, which is located within the material, in case of afinite distance between lens and material. Furthermore, length l offocal line 2 b is related to the beam diameter for the availablerefraction indices and cone angles of axicon 9, which is why, in case ofrelatively thin materials (several millimeters), the total focal line istoo long, having the effect that the laser energy is again notspecifically focused into the material.

This is the reason for an enhanced optical assembly 6 which comprisesboth an axicon and a focusing lens. FIG. 5A depicts such an opticalassembly 6 in which a first optical element (viewed along the beamdirection) with a non-spherical free surface designed to form anextensive laser beam focal line 2 b is positioned in the beam path oflaser 3. In the case shown in FIG. 5A, this first optical element is anaxicon 10 with a cone angle of 5°, which is positioned perpendicularlyto the beam direction and centered on laser beam 3. The apex of theaxicon is oriented towards the beam direction. A second, focusingoptical element, here the plano-convex lens 11 (the curvature of whichis oriented towards the axicon), is positioned in beam direction at adistance z1 from the axicon 10. The distance z1, in this caseapproximately 300 mm, is selected in such a way that the laser radiationformed by axicon 10 circularly incides on the marginal area of lens 11.Lens 11 focuses the circular radiation on the output side at a distancez2, in this case approximately 20 mm from lens 11, on a focal line 2 bof a defined length, in this case 1.5 mm. The effective focal length oflens 11 is 25 mm here. The circular transformation of the laser beam byaxicon 10 is labeled with the reference SR.

FIG. 5B depicts the formation of the focal line 2 b or the inducedabsorption 2 c in the material of substrate 1 according to FIG. 5A indetail. The optical characteristics of both elements 10, 11 as well asthe positioning of them is selected in such a way that the extension 1of the focal line 2 b in beam direction is exactly identical with thethickness d of substrate 1. Consequently, an exact positioning ofsubstrate 1 along the beam direction is required in order to positionthe focal line 2 b exactly between the two surfaces 1 a and 1 b ofsubstrate 1, as shown in FIG. 5B.

It is therefore advantageous if the focal line is formed at a certaindistance from the laser optics, and if the greater part of the laserradiation is focused up to a desired end of the focal line. Asdescribed, this can be achieved by illuminating a primarily focusingelement 11 (lens) only circularly on a required zone, which, on the onehand, serves to realize the required numerical aperture and thus therequired spot size, on the other hand, however, the circle of diffusiondiminishes in intensity after the required focal line 2 b over a veryshort distance in the center of the spot, as a basically circular spotis formed. In this way, the crack formation is stopped within a shortdistance in the required substrate depth. A combination of axicon 10 andfocusing lens 11 meets this requirement. The axicon acts in twodifferent ways: due to the axicon 10, a usually round laser spot is sentto the focusing lens 11 in the form of a ring, and the asphericity ofaxicon 10 has the effect that a focal line is formed beyond the focalplane of the lens instead of a focal point in the focal plane. Thelength l of focal line 2 b can be adjusted via the beam diameter on theaxicon. The numerical aperture along the focal line, on the other hand,can be adjusted via the distance z1 axicon-lens and via the cone angleof the axicon. In this way, the entire laser energy can be concentratedin the focal line.

If the crack formation (i.e., defect line) is supposed to continue tothe emergence side of the substrate, the circular illumination still hasthe advantage that, on the one hand, the laser power is used in the bestpossible way as a large part of the laser light remains concentrated inthe required length of the focal line, on the other hand, it is possibleto achieve a uniform spot size along the focal line—and thus a uniformseparation process along the focal line—due to the circularlyilluminated zone in conjunction with the desired aberration set by meansof the other optical functions.

Instead of the plano-convex lens depicted in FIG. 5A, it is alsopossible to use a focusing meniscus lens or another higher correctedfocusing lens (asphere, multi-lens system).

In order to generate very short focal lines 2 b using the combination ofan axicon and a lens depicted in FIG. 5A, it would be necessary toselect a very small beam diameter of the laser beam inciding on theaxicon. This has the practical disadvantage that the centering of thebeam onto the apex of the axicon must be very precise and that thereforethe result is very sensitive to direction variations of the laser (beamdrift stability). Furthermore, a tightly collimated laser beam is verydivergent, i.e. due to the light deflection the beam bundle becomesblurred over short distances.

As shown in FIG. 6, both effects can be avoided by inserting anotherlens, a collimating lens 12: this further, positive lens 12 serves toadjust the circular illumination of focusing lens 11 very tightly. Thefocal length f′ of collimating lens 12 is selected in such a way thatthe desired circle diameter dr results from distance z1 a from theaxicon to the collimating lens 12, which is equal to f′. The desiredwidth br of the ring can be adjusted via the distance z1 b (collimatinglens 12 to focusing lens 11). As a matter of pure geometry, the smallwidth of the circular illumination leads to a short focal line. Aminimum can be achieved at distance f′.

The optical assembly 6 depicted in FIG. 6 is thus based on the onedepicted in FIG. 5A so that only the differences are described below.The collimating lens 12, here also designed as a plano-convex lens (withits curvature towards the beam direction) is additionally placedcentrally in the beam path between axicon 10 (with its apex towards thebeam direction), on the one side, and the plano-convex lens 11, on theother side. The distance of collimating lens 12 from axicon 10 isreferred to as z1 a, the distance of focusing lens 11 from collimatinglens 12 as z1 b, and the distance of the generated focal line 2 b fromthe focusing lens 11 as z2 (always viewed in beam direction). As shownin FIG. 6, the circular radiation SR formed by axicon 10, which incidesdivergently and under the circle diameter dr on the collimating lens 12,is adjusted to the required circle width br along the distance z1 b foran at least approximately constant circle diameter dr at the focusinglens 11. In the case shown, a very short focal line 2 b is supposed tobe generated so that the circle width br of approx. 4 mm at lens 12 isreduced to approx. 0.5 mm at lens 11 due to the focusing properties oflens 12 (circle diameter dr is 22 mm in the example).

In the depicted example it is possible to achieve a length of the focalline l of less than 0.5 min using a typical laser beam diameter of 2 mm,a focusing lens 11 with a focal length f=25 mm, and a collimating lenswith a focal length f=150 mm. Furthermore applies Z1 a=Z1 b=140 mm andZ2=15 mm.

FIGS. 7A-7C illustrate the laser-matter interaction at different laserintensity regimes. In the first case, shown in FIG. 7A, the unfocusedlaser beam 710 goes through a transparent substrate 720 withoutintroducing any modification to it. In this particular case, thenonlinear effect is not present because the laser energy density (orlaser energy per unit area illuminated by the beam) is below thethreshold necessary to induce nonlinear effects. The higher the energydensity, the higher is the intensity of the electromagnetic field.Therefore, as shown in FIG. 7B when the laser beam is focused byspherical lens 730 to a smaller spot size, as shown in FIG. 7B, theilluminated area is reduced and the energy density increases, triggeringthe nonlinear effect that will modify the material to permit formationof a fault line only in the volume where that condition is satisfied. Inthis way, if the beam waist of the focused laser is positioned at thesurface of the substrate, modification of the surface will occur. Incontrast, if the beam waist of the focused laser is positioned below thesurface of the substrate, nothing happens at the surface when the energydensity is below the threshold of the nonlinear optical effect. But atthe focus 740, positioned in the bulk of the substrate 720, the laserintensity is high enough to trigger multi-photon non-linear effects,thus inducing damage to the material. Finally, as shown in FIG. 7C inthe case of an axicon, as shown in FIG. 7C, the diffraction pattern ofan axicon lens 750, or alternatively a Fresnel axicon, createsinterference that generates a Bessel-shaped intensity distribution(cylinder of high intensity 760) and only in that volume is theintensity high enough to create nonlinear absorption and modification tothe material 720. The diameter of cylinder 760, in which Bessel-shapedintensity distribution is high enough to create nonlinear absorption andmodification to the material, is also the spot diameter of the laserbeam focal line, as referred to herein. Spot diameter D of a Bessel beamcan be expressed as D=(2.4048λ)/(2πB), where λ is the laser beamwavelength and B is a function of the axicon angle.

Note that typical operation of such a picosecond laser described hereincreates a “burst” 500 of pulses 500A. (See, for example, FIGS. 8A and8B). Each “burst” (also referred to herein as a “pulse burst” 500)contains multiple individual pulses 500A (such as at least 2 pulses, atleast 3 pulses, at least 4 pulses, at least 5 pulses, at least 10pulses, at least 15 pulses, at least 20 pulses, or more) of very shortduration. That is, a pulse bust is a “pocket” of pulses, and the burstsare separated from one another by a longer duration than the separationof individual adjacent pulses within each burst. Pulses 500A have pulseduration T_(d) of up to 100 psec (for example, 0.1 psec, 5 psec, 10psec, 15 psec, 18 psec, 20 psec, 22 psec, 25 psec, 30 psec, 50 psec, 75psec, or therebetween). The energy or intensity of each individual pulse500A within the burst may not be equal to that of other pulses withinthe burst, and the intensity distribution of the multiple pulses withina burst 500 often follows an exponential decay in time governed by thelaser design. Preferably, each pulse 500A within the burst 500 of theexemplary embodiments described herein is separated in time from thesubsequent pulse in the burst by a duration T_(p) from 1 nsec to 50 nsec(e.g. 10-50 nsec, or 10-30 nsec, with the time often governed by thelaser cavity design). For a given laser, the time separation T_(p)between adjacent pulses (pulse-to-pulse separation) within a burst 500is relatively uniform (±10%). For example, in some embodiments, eachpulse within a burst is separated in time from the subsequent pulse byapproximately 20 nsec (50 MHz). For example, for a laser that producespulse separation T_(p) of about 20 nsec, the pulse to pulse separationT_(p) within a burst is maintained within about ±10%, or about ±2 nsec.The time between each “burst” of pulses (i.e., time separation T_(b)between bursts) will be much longer (e.g., 0.25≦T_(b)≦1000 microseconds,for example 1-10 microseconds, or 3-8 microseconds). In some of theexemplary embodiments of the laser described herein the time separationT_(b) is around 5 microseconds for a laser with pulse burst repetitionrate or frequency of about 200 kHz. The laser burst repetition rate isrelates to the time T_(b) between the first pulse in a burst to thefirst pulse in the subsequent burst (laser burst repetitionrate=1/T_(b)). In some embodiments, the laser burst repetition frequencymay be in a range of between about 1 kHz and about 4 MHz. Morepreferably, the laser burst repetition rates can be, for example, in arange of between about 10 kHz and 650 kHz. The time T_(b) between thefirst pulse in each burst to the first pulse in the subsequent burst maybe 0.25 microsecond (4 MHz burst repetition rate) to 1000 microseconds(1 kHz burst repetition rate), for example 0.5 microseconds (2 MHz burstrepetition rate) to 40 microseconds (25 kHz burst repetition rate), or 2microseconds (500 kHz burst repetition rate) to 20 microseconds (50 k Hzburst repetition rate). The exact timings, pulse durations, and burstrepetition rates can vary depending on the laser design, but shortpulses (T_(d)<20 psec and preferably T_(d)≦15 psec) of high intensityhave been shown to work particularly well.

The energy required to modify the material can be described in terms ofthe burst energy—the energy contained within a burst (each burst 500contains a series of pulses 500A), or in terms of the energy containedwithin a single laser pulse (many of which may comprise a burst). Forthese applications, the energy per burst can be from 25-750 μJ, morepreferably 50-500 μJ, or 50-250 μJ. In some embodiments the energy perburst is 100-250 μJ. The energy of an individual pulse within the pulseburst will be less, and the exact individual laser pulse energy willdepend on the number of pulses 500A within the pulse burst 500 and therate of decay (e.g., exponential decay rate) of the laser pulses withtime as shown in FIGS. 8A and 8B. For example, for a constantenergy/burst, if a pulse burst contains 10 individual laser pulses 500A,then each individual laser pulse 500A will contain less energy than ifthe same pulse burst 500 had only 2 individual laser pulses.

The use of a laser capable of generating such pulse bursts isadvantageous for cutting or modifying transparent materials, for exampleglass. In contrast with the use of single pulses spaced apart in time bythe repetition rate of the single-pulsed laser, the use of a pulse burstsequence that spreads the laser energy over a rapid sequence of pulseswithin the burst 500 allows access to larger timescales of highintensity interaction with the material than is possible withsingle-pulse lasers. While a single-pulse can be expanded in time, asthis is done the intensity within the pulse must drop as roughly oneover the pulse width. Hence if a 10 psec single pulse is expanded to a10 nsec pulse, the intensity drop by roughly three orders of magnitude.Such a reduction can reduce the optical intensity to the point wherenon-linear absorption is no longer significant, and light materialinteraction is no longer strong enough to allow for cutting. Incontrast, with a pulse burst laser, the intensity during each pulse 500Awithin the burst 500 can remain very high—for example three 10 psecpulses 500A spaced apart in time by approximately 10 nsec still allowsthe intensity within each pulse to be approximately three times higherthan that of a single 10 psec pulse, while the laser is allowed tointeract with the material over a timescale that is now three orders ofmagnitude larger. This adjustment of multiple pulses 500A within a burstthus allows manipulation of time-scale of the laser-material interactionin ways that can facilitate greater or lesser light interaction with apre-existing plasma plume, greater or lesser light-material interactionwith atoms and molecules that have been pre-excited by an initial orprevious laser pulse, and greater or lesser heating effects within thematerial that can promote the controlled growth of microcracks. Therequired amount of burst energy to modify the material will depend onthe substrate material composition and the length of the line focus usedto interact with the substrate. The longer the interaction region, themore the energy is spread out, and higher burst energy will be required.The exact timings, pulse durations, and burst repetition rates can varydepending on the laser design, but short pulses (<15 psec, or ≦10 psec)of high intensity have been shown to work well with this technique. Adefect line or a hole is formed in the material when a single burst ofpulses strikes essentially the same location on the glass. That is,multiple laser pulses within a single burst correspond to a singledefect line or a hole location in the glass. Of course, since the glassis translated (for example by a constantly moving stage) (or the beam ismoved relative to the glass, the individual pulses within the burstcannot be at exactly the same spatial location on the glass. However,they are well within 1 μm of one another—i. e., they strike the glass atessentially the same location. For example, they may strike the glass ata spacing, sp, from one another where 0<sp≦500 nm. For example, when aglass location is hit with a burst of 20 pulses the individual pulseswithin the burst strike the glass within 250 nm of each other. Thus, insome embodiments 1 nm<sp<250 nm. In some embodiments 1 nm<sp<100 nm.

Multi-photon effects, or multi-photon absorption (MPA) is thesimultaneous absorption of two or more photons of identical or differentfrequencies in order to excite a molecule from one state (usually theground state) to a higher energy electronic state (ionization). Theenergy difference between the involved lower and upper states of themolecule can be equal to the sum of the energies of the two photons.MPA, also called induced absorption, can be can be a second-order,third-order process, or higher-order process, for example, that isseveral orders of magnitude weaker than linear absorption. MPA differsfrom linear absorption in that the strength of induced absorption can beproportional to the square or cube (or higher power law) of the lightintensity, for example, instead of being proportional to the lightintensity itself. Thus, MPA is a nonlinear optical process.

The lateral spacing (pitch) between the defect lines (damage tracks) isdetermined by the pulse rate of the laser as the substrate is translatedunderneath the focused laser beam. Only a single picosecond laser pulseburst is usually necessary to form an entire hole, but multiple burstsmay be used if desired. To form damage tracks (defect lines) atdifferent pitches, the laser can be triggered to fire at longer orshorter intervals. For cutting operations, the laser triggeringgenerally is synchronized with the stage driven motion of the workpiecebeneath the beam, so laser pulse bursts are triggered at a fixedspacing, such as for example every 1 micron, or every 5 microns.Distance, or periodicity, between adjacent perforations or defect linesalong the direction of the fault line can be greater than 0.1 micron andless than or equal to about 20 microns in some embodiments, for example.For example, the spacing or periodicity between adjacent perforations ordefect lines is between 0.5 and 15 microns, or between 3 and 10 microns,or between 0.5 micron and 3.0 microns. For example, in some embodimentsthe periodicity can be between 2 micron and 8 microns.

We discovered that using pulse burst lasers with certain volumetricpulse energy density (μJ/μm³) within the approximately cylindricalvolume of the line focus re preferable to create the perforated contoursin the glass. This can be achieved, for example, by utilizing pulseburst lasers, preferably with at least 2 pulses per burst and providingvolumetric energy densities within the alkaline earthboro-aluminosilicate glasses (with low or no alkali) of about 0.005μJ/μm³ or higher to ensure a damage track is formed, but less than 0.100μJ/μ³ so as to not damage the glass too much, for example 0.005μJ/μm³-0.100 μJ/μm³

Interior Contour Process

FIG. 1 illustrates the problem to be solved. A part 22 is to be cut outof a glass sheet 20. To release the outer contour of a part, additionalrelease lines can be cut in the larger glass sheet that extend any cracklines to the edges of the sheet, allowing the glass to break intosections which can be removed. However, for interior contours such asthose needed for a home button on a phone, creating additional releaselines would cut through the part of interest. Thus the interior hole orslot is “locked in place”, and is difficult to remove. Even if the glassis high stress and crack propagate from perforation to perforation inthe outer diameter of the hole or slot, the interior glass will notrelease, as the material will be too rigid and is held by compressionalforce.

One manner of releasing a larger hole is to first perforate the contourof the hole, and then follow up with a laser heating process, such aswith a CO₂ laser, that heats up the inner glass piece until it softensand then is compliant enough to drop out. This works well for largerhole diameters and thinner materials. However, as the aspect ratio(thickness/diameter) of the glass plug gets very large, such methodshave more difficulty. For example, with such methods, 10 mm diameterholes can be released from 0.7 mm thick glass, but <4 mm holes cannotalways be released in the same glass thickness.

FIG. 8C illustrates a process that solves this problem, and has beensuccessfully used to separate holes down to 1.5 mm diameter out of 0.7mm thick code 2320 glass (ion-exchanged and non-ion exchanged), and alsoto create slots with widths and radii as small as 1.5 mm. Step 1—Aperforation of a first contour 24 is made in glass sheet 20 using thepicosecond pulse burst process that defines the desired shape of thecontour (e.g., hole, slot) to be cut. For example, for Corning's code2320 0.7 mm thick non-ion exchanged glass, 210 μJ bursts were used topitch to perforate the material and to create damage tracks or defectlines at 4 μm pitch. Depending on the exact material, other damage trackspacings may also be employed, such as 1-15 microns, or 3-10 microns, or3-7 microns. For ion-exchangeable glasses such as those described above,3-7 micron pitch works well, but for other glasses such as the displayglass Eagle XG, smaller pitches may be preferred, such a 1-3 microns. Inthe embodiments described herein, typical pulse burst laser powers are10 W-150 Watts with laser powers of 25-60 Watts being sufficient (andoptimum) for many glasses.

Step 2—A second perforation line 26 is formed to form a second contourinside of the first contour, using the same laser process, butapproximately a few hundred microns inside the first contour. This stepis optional, but is often preferred, as the extra perforation isdesigned to act as a thermal barrier and to promote the fragmentationand removal of material inside the hole when the next process step isemployed.

Step 3—A highly focused CO₂ laser 28 is used to ablate the materialinside the hole, by tracing out the approximate path defined by thesecond perforation contour described above, or slightly (100 μm) insidethe 2nd contour. This will physically melt, ablate, and drive out theglass material inside of the hole or slot. For code 2320 0.7 mm thicknon-ion exchanged glass available from Corning Incorporated, a CO₂ laserpower of about 14 Watts with a focused spot size of about 100 μmdiameter was used, and the CO₂ laser was translated around the path at aspeed of about 0.35 m/min, executing 1-2 passes to completely remove thematerial, the number of passes begin dependent on the exact geometry ofthe hole or slot. In general, for this process step, the CO₂ beam wouldbe defined as “focused” if it achieved a high enough intensity such thatthe glass material is melted and/or ablated by the high intensity. Forexample, the power density of the focused spot can be about 1750 W/mm²,which would be accomplished with the above described conditions, orcould be from 500 W/mm² to 5000 W/mm², depending on the desired speed oftraversal of the laser beam across the surface.

In addition, as shown in FIG. 9, a highly velocity assist gas such aspressurized air or nitrogen is blown through a nozzle surrounding theCO₂ laser head 32. This blows a directed stream of gas at the focusedCO₂ laser spot on the glass, and helps force the loosened glass materialout of the larger substrate. Multiple passes of the CO₂ laser, at thesame inner radius or slightly different inner radii may be used,depending on the resistance of the material to the forced removal. Inthe case of the above high pressure compressed air was forced through aabout 1 mm nozzle using a pressure of 80 psi. The nozzle was positionedabout 1 mm above the glass substrate during the ablation, and the CO₂beam was focused such that it passed without vignetting through theaperture of the nozzle.

FIG. 9 shows a side view of the above this process, to illustrate howthe CO₂ ablation and air nozzle will create loosened material and forceit out of the interior of the hole or slot.

Sample Results:

FIG. 10 shows the results of the process, for a cover glass for atypical handheld phone. The geometry of the oblong hole (home button)was about 5.2 mm by 16 mm, with about 1.5 mm radius corners, and for theslot, it was 15 mm long, 1.6 mm wide, with about 0.75 mm radii on theends. Excellent edge quality (Ra of about 0.5 microns, no chippingobservable under a 100× magnification microscope) and consistentmaterial removal and separation were observed over >100 parts using thisprocess.

FIG. 11 shows an angled view of the interior edge. The edge shows thesame textured damage track or filament structure achieved with outercontours made with the same damage track or filamentation process, whichis shown for comparison in FIG. 12. This indicates that the CO₂ ablationprocess described above has removed the loosened interior materialwithout damaging the high quality, low roughness, and low sub-surfaceedge which is generally created with the picosecond perforation processdescribed above.

FIG. 13 shows a top view of the cut edge of a slot made with the processdescribed. No chirping or checking is observed on the edge of thecontour. This contour has a radius of about 2 mm.

As illustrated in FIGS. 14A-14C, the method to cut and separatetransparent materials, and more specifically TFT glass compositions, isessentially based on creating a fault line 110 formed of a plurality ofvertical defect lines 120 in the material or workpiece 130 to beprocessed with an ultra-short pulsed laser 140. The defect lines 120extend, for example, through the thickness of the glass sheet, and areorthogonal to the major (flat) surfaces of the glass sheet. “Faultlines” are also referred to as “contours” herein. While fault lines orcontours can be linear, like the fault line 110 illustrated in FIG. 14A,the fault lines or contours can also be nonlinear, having a curvature.Curved fault lines or contours can be produced by translating either theworkpiece 130 or laser beam 140 with respect to the other in twodimensions instead of one dimension, for example. Depending on thematerial properties (absorption, CTE, stress, composition, etc.) andlaser parameters chosen for processing the material 130, the creation ofa fault line 110 alone can be enough to induce self-separation. In thiscase, no secondary separation processes, such as tension/bending forcesor thermal stress created for example by a CO₂ laser, are necessary. Asillustrated in FIG. 14A, a plurality of defect lines can define acontour. The separated edge or surface with the defect lines is definedby the contour. The induced absorption creating the defect lines canproduce particles on the separated edge or surface with an averagediameter of less than 3 microns, resulting in a very clean cuttingprocess.

In some cases, the created fault line is not enough to separate thematerial spontaneously, and a secondary step may be necessary. While theperforated glass part may be placed in an chamber such as an oven tocreate a bulk heating or cooling of the glass part, to create thermalstress to separate the parts along the defect line, such a process canbe slow and may require large ovens or chambers to accommodate many artsor large pieces or perforated glass. If so desired, a second laser canbe used to create thermal stress to separate it, for example. In thecase of TFT glass compositions, separation can be achieved, after thecreation of a fault line, by application of mechanical force or by usinga thermal source (e.g., an infrared laser, for example a CO₂ laser) tocreate thermal stress and force separation of the material. Anotheroption is to have the CO₂ laser only start the separation and thenfinish the separation manually. The optional CO₂ laser separation isachieved, for example, with a defocused continuous wave (cw) laseremitting at 10.6 microns and with power adjusted by controlling its dutycycle. Focus change (i.e., extent of defocusing up to and includingfocused spot size) is used to vary the induced thermal stress by varyingthe spot size. Defocused laser beams include those laser beams thatproduce a spot size larger than a minimum, diffraction-limited spot sizeon the order of the size of the laser wavelength. For example, CO2 laserspot sizes of 1 to 20 mm, for example 1 to 12 mm, 3 to 8 mm, or about 7mm, 2 mm, and 20 mm can be used for CO₂ lasers, for example, with a CO₂10.6 μm wavelength laser. Other lasers, whose emission wavelength isalso absorbed by the glass, may also be used, such as lasers withwavelengths emitting in the 9-11 micron range, for example. In suchcases CO₂ laser with power levels between 100 and 400 Watts may be used,and the beam may be scanned at speeds of 50-500 mm/sec along or adjacentto the defect lines, which creates sufficient thermal stress to induceseparation. The exact power levels, spot sizes, and scanning speedschosen within the specified ranges may depend on the material use, itsthickness, coefficient of thermal expansion (CTE), elastic modulus,since all of these factors influence the amount of thermal stressimparted by a specific rate of energy deposition at a given spatiallocation. If the spot size is too small (i.e. <1 mm), or the CO₂ laserpower is too high (>400 W), or the scanning speed is too slow (less than10 mm/sec), the glass may be over heated, creating ablation, melting orthermally generated cracks in the glass, which are undesirable, as theywill reduce the edge strength of the separated parts. Preferably the CO₂laser beam scanning speed is >50 mm/sec, in order to induce efficientand reliable part separation. However, if the spot size created by theCO₂ laser is too large (>20 mm), or the laser power is too low (<10 W,or in some cases <30 W), or the scanning speed is too high (>500mm/sec), insufficient heating occurs which results in too low a thermalstress to induce reliable part separation.

For example, in some embodiments, a CO₂ laser power of 200 Watts may beused, with a spot diameter at the glass surface of approximately 6 mm,and a scanning speed of 250 mm/sec to induce part separation for 0.7 mmthick Corning Eagle XG® glass that has been perforated with the abovementioned psec laser. For example a thicker Corning Eagle XG® glasssubstrate may require more CO₂ laser thermal energy per unit time toseparate than a thinner Eagle XG® substrate, or a glass with a lower CTEmay require more CO₂ laser thermal energy to separate than a glass witha lower CTE. Separation along the perforated line will occur veryquickly (less than 1 second) after CO₂ spot passes a given location, forexample within 100 milliseconds, within 50 milliseconds, or within 25milliseconds.

Distance, or periodicity, between adjacent defect lines 120 along thedirection of the fault lines 110 can be greater than 0.1 micron and lessthan or equal to about 20 microns in some embodiments, for example. Forexample, in some embodiments, the periodicity between adjacent defectlines 120 may be between 0.5 and 15 microns, or between 3 and 10microns, or between 0.5 micron and 3.0 microns. For example, in someembodiments the periodicity between adjacent defect lines 120 can bebetween 0.5 micron and 1.0 micron.

There are several methods to create the defect line. The optical methodof forming the line focus can take multiple forms, using donut shapedlaser beams and spherical lenses, axicon lenses, diffractive elements,or other methods to form the linear region of high intensity. The typeof laser (picosecond, femtosecond, etc.) and wavelength (IR, green, UV,etc.) can also be varied, as long as sufficient optical intensities arereached to create breakdown of the substrate material in the region offocus to create breakdown of the substrate material or glass workpiece,through nonlinear optical effects. Preferably, the laser is a pulseburst laser which allows for control of the energy deposition with timeby adjusting the number of pulses within a given burst.

In the present application, an ultra-short pulsed laser is used tocreate a high aspect ratio vertical defect line in a consistent,controllable and repeatable manner. The details of the optical setupthat enables the creation of this vertical defect line are describedbelow, and in U.S. Application No. 61/752,489 filed on Jan. 15, 2013,the entire contents of which are incorporated by reference as if fullyset forth herein. The essence of this concept is to use optics to createa line focus of a high intensity laser beam within a transparent part.One version of this concept is to use an axicon lens element in anoptical lens assembly to create a region of high aspect ratio,taper-free microchannels using ultra-short (picoseconds or femtosecondduration) Bessel beams. In other words, the axicon condenses the laserbeam into a high intensity region of cylindrical shape and high aspectratio (long length and small diameter). Due to the high intensitycreated with the condensed laser beam, nonlinear interaction of theelectromagnetic field of the laser and the substrate material occurs andthe laser energy is transferred to the substrate to effect formation ofdefects that become constituents of the fault line. However, it isimportant to realize that in the areas of the material where the laserenergy intensity is not high (e.g., glass volume of substratesurrounding the central convergence line), the material is transparentto the laser and there is no mechanism for transferring energy from thelaser to the material. As a result, nothing happens to the glass orworkpiece when the laser intensity is below the nonlinear threshold.

The methods described above provide the following benefits that maytranslate to enhanced laser processing capabilities and cost savings andthus lower cost manufacturing. The cutting process offers:

1) Full separation of interior contours being cut: the methods describedabove are capable of completely separating/cutting holes and slots in aclean and controlled fashion in ion-exchangeable glass (such as Gorilla®glass, Corning glass codes 2318, 2319, 2320 or the like) as produced bythe fusion draw process, or other glass forming processes, before theglass part has undergone chemical strengthening.

2) Separation of holes/slots with very small dimensions: Other processesmay be used to heat and induce softening of a glass plug which can allowit to drop out of a glass sheet. However, as the aspect ratio(thickness/diameter) of the glass plug gets very large, such methodsfail. For example, heating (not ablation) of the interior glass plugwill drop out 10 mm diameter holes out of 0.7 mm thick glass, but if thediameter of the hole is reduced to 4 mm, such processes will not work.However, the process disclosed here has been used to remove glass plugsthat have dimensions as small as 1.5 mm (diameter of a circle, or widthof a slot) in 0.7 mm thick glass.

3) Reduced subsurface defects and excellent edge quality: Due to theultra-short pulse interaction between laser and material, there islittle thermal interaction and thus a minimal heat affected zone thatcan result in undesirable stress and micro-cracking. In addition, theoptics that condense the laser beam into the glass creates defect linesthat are typically 2 to 5 microns diameter on the surface of the part.After separation, the subsurface damage is <75 μm, and can be adjustedto be <25 μm. The roughness of the separated surface (or cut edge),results particularly from the spot size or the spot diameter of thefocal line. A roughness of the separated (cut) surface which can be, forexample, 0.1 to 1 microns or for example 0.25 to 1 microns), can becharacterized, for example, by an Ra surface roughness statistic(roughness arithmetic average of absolute values of the heights of thesampled surface, which include the heights of bumps resulting from thespot diameter of the focal line). The surface roughness generated bythis process is often <0.5 μm (Ra), and can be as low as 0.1 μm (Ra).This has great impact on the edge strength of the part as strength isgoverned by the number of defects, their statistical distribution interms of size and depth. The higher these numbers are the weaker theedges of the part will be. In addition, if any mechanical finishingprocesses such as grinding and polishing are later used to modify theedge shape, the amount of material removal required will be lower forparts with less sub-surface damage. This reduces or eliminates finishingsteps, lower part cost. The hole and slot release process described heretakes full advantage of the high-quality edge created by this line-focuspicosecond laser perforation process—it ensures that the removal of theinterior glass material is done in a manner that cleanly releases theglass along this perforation line, and does not induce ablative damage,micro-cracking, or other defects to the desired part edge.

Speed: Unlike processes which use focused laser to purely ablate thematerial around the inner contour, this laser process is a single passprocess for the perforation line. The perforated hole contour may becreated by the picosecond laser process described herein at speeds of80-1000 mm/sec, depending only on the acceleration capabilities of thestages involved. This is in contrast to ablative hole and slot drillingmethods, where material is removed “layer by layer” and requires manypasses or long residence times per location of the laser beam.

Process cleanliness: the methods described above are capable ofseparating/cutting glass or other transparent brittle materials in aclean and controlled fashion. It is very challenging to use conventionalablative or thermal laser processes because they tend to trigger heataffected zones that induce micro-cracks and fragmentation of the glassinto several smaller pieces. The characteristics of the laser pulses andthe induced interactions with the material of the disclosed method avoidall of these issues because they occur in a very short time scale andthe material transparency to the laser radiation minimizes the inducedthermal effects. Since the defect line is created within the object, thepresence of debris and adhered particles during the cutting step isvirtually eliminated. If there are any particulates resulting from thecreated defect line, they are well contained until the part isseparated.

Cutting Complex Profiles and Shapes in Different Sizes

The methods described above enable cutting/separation of glass and othersubstrates following many forms and shapes, which is a limitation inother competing technologies. Tight radii may be cut (<2 mm), allowingcreation of small holes and slots (such as required forspeakers/microphone in a cell phone application). Also, since the defectlines strongly control the location of any crack propagation, thosemethod give great control to the spatial location of a cut, and allowfor cut and separation of structures and features as small as a fewhundred microns.

Elimination of Process Steps

The process to fabricate glass plates from the incoming glass panel tothe final size and shape involves several steps that encompass cuttingthe panel, cutting to size, finishing and edge shaping, thinning theparts down to their target thickness, polishing, and even chemicallystrengthening in some cases. Elimination of any of these steps willimprove manufacturing cost in terms of process time and capital expense.The methods described above may reduce the number of steps by, forexample:

Reduced debris and edge defects generation—potential elimination ofwashing and drying stations

Cutting the sample directly to its final size, shape andthickness—eliminating need for finishing lines.

Thus, according to some embodiments, a glass article has at least oneinner contour edge with plurality of defect lines extendingperpendicular to the face of the glass sheet at least 250 μm, the defectlines each having a diameter less than or equal to about 5 μm. Forexample, a glass article has at least one inner contour edge having aplurality of defect lines extending perpendicular to the major (i.e.,large relative to the sides) flat face of the glass sheet at least 250μm, the defect lines each having a diameter less than or equal to about5 μm. In some embodiments, the smallest dimension or width of theinterior contour defined by the inner contour edge is less than 5 mm,for example it may be 0.1 mm to 3 mm in width (or diameter), e.g, 0.5 mmto 2 mm. According to some embodiments, the glass article comprisespost-ion exchange glass. According to some embodiments, the defect linesextend the full thickness of the at least one inner contour edge.According to at least some embodiments, the at least one inner contouredge has an Ra surface roughness less than about 0.5 μm. According to atleast some embodiments, the at least one inner contour edge hassubsurface damage up to a depth less than or equal to about 75 μm. In atleast some embodiments, of the glass article the defect lines extend thefull thickness of the edge. The distance between the defect lines is,for example, less than or equal to about 7 μm.

The relevant teachings of all patents, published applications andreferences cited herein are incorporated by reference in their entirety.

While exemplary embodiments have been disclosed herein, it will beunderstood by those skilled in the art that various changes in form anddetails may be made therein without departing from the scope of theinvention encompassed by the appended claims.

What is claimed is:
 1. A method of laser drilling a material comprising:focusing a pulsed laser beam into a laser beam focal line, viewed alongthe beam propagation direction; directing the laser beam focal line intothe material at a first location, the laser beam focal line generatingan induced absorption within the material, the induced absorptionproducing a damage track along the laser beam focal line within thematerial; translating the material and the pulsed laser beam relative toeach other starting from the first location along a first closedcontour, thereby laser drilling a plurality of holes along the firstclosed contour within the material; and directing a focused carbondioxide (CO2) laser into the material around a second closed contourcontained within the first closed contour to facilitate removal of aninner plug of the material along the first closed contour.
 2. The methodof claim 1, further comprising: directing the laser beam focal line intothe material at a second location, the laser beam focal line generatingan induced absorption within the material, the induced absorptionproducing a damage track along the laser beam focal line within thematerial; and translating the material and the pulsed laser beamrelative to each other starting from the second location along a thirdclosed contour, thereby laser drilling a plurality of damage tracksalong the third closed contour within the material, the third closedcontour contained within the first closed contour.
 3. The method ofclaim 2, wherein the second closed contour is offset from the firstclosed contour by less than 500 μm.
 4. The method of claim 2, whereinthe second closed contour and the third closed contour coincide.
 5. Themethod of claim 2, wherein the second closed contour is containedbetween the first closed contour and third closed contour.
 6. The methodof claim 2, wherein the second closed contour is contained within thethird closed contour at an offset of less than 500 μm.
 7. The method ofclaim 1, further comprising directing an assist gas toward the materialand collinear with the CO₂ laser beam.
 8. The method of claim 1, whereinremoval of the inner plug defines an opening in the material, theopening having a width between 0.5 mm and 100 mm.
 9. The method of claim1, wherein removal of the inner plug defines a slot in the material thathas a width between 0.5 mm and 100 mm.
 10. The method of claim 1,wherein the induced absorption produces subsurface damage at the firstcontour of up to a depth less than or equal to about 75 μm within thematerial.
 11. The method of claim 1, wherein the induced absorptionproduces an Ra surface roughness at the first contour of less than orequal to about 0.5 μm.
 12. The method of claim 1, wherein the materialhas a thickness in a range of between about 100 μm and about 8 mm. 13.The method of claim 1, wherein the material and pulsed laser beam aretranslated relative to each other at a speed in a range of between about1 mm/sec and about 3400 mm/sec.
 14. The method of claim 1, wherein thepulse duration is in a range of between greater than about 1 picosecondand less than about 100 picoseconds.
 15. The method of claim 14, whereinthe pulse duration is in a range of between greater than about 5picoseconds and less than about 20 picoseconds.
 16. The method of claim1, wherein the repetition rate is in a range of between about 1 kHz and2 MHz.
 17. The method of claim 16, wherein the repetition rate is in arange of between about 10 kHz and 650 kHz.
 18. The method of claim 1,wherein the pulsed laser beam has an energy per burst measured at thematerial greater than 40 μJ per mm thickness of material.
 19. The methodof claim 1, wherein the pulses are produced in pulse bursts of at leasttwo pulses separated by a duration in a range of between about 1 nsecand about 50 nsec, and the burst repetition frequency is in a range ofbetween about 1 kHz and about 650 kHz.
 20. The method of claim 19,wherein the pulses are separated by a duration of about 10-50 nsec. 21.The method of claim 1, wherein the pulsed laser beam has a wavelengthselected such that the material is substantially transparent at thiswavelength.
 22. The method of claim 1, wherein the laser beam focal linehas a length in a range of between about 0.1 mm and about 100 mm. 23.The method of claim 22, wherein the laser beam focal line has a lengthin a range of between about 0.1 mm and about 10 mm.
 24. The method ofclaim 23, wherein the laser beam focal line has a length in a range ofbetween about 0.1 mm and about 1 mm.
 25. The method of claim 1, whereinthe laser beam focal line has an average spot diameter in a range ofbetween about 0.1 μm and about 5 μm.
 26. The method of claim 1, whereinthe material comprises chemically strengthened glass.
 27. The method ofclaim 1, wherein the material comprises non-strengthened glass.
 28. Aglass article prepared by the method of claim
 1. 29. A glass articlehaving at least one inner contour edge having a plurality of defectlines extending perpendicular to the major face of the glass sheet atleast 250 μm, the defect lines each having a diameter less than or equalto about 5 μm.
 30. A glass article according to claim 29, wherein saidmajor face of glass sheet is flat.
 31. The glass article of claim 29where the smallest dimension or width of the inner contour defined bythe inner contour edge is less than 5 mm.
 32. The glass article of claim29, wherein the glass article comprises post-ion exchange glass.
 33. Theglass article of claim 29, wherein the defect lines extend the fullthickness of the at least one inner contour edge.
 34. The glass articleof claim 29, wherein the at least one inner contour edge has an Rasurface roughness less than about 0.5 μm.
 35. The glass article of claim29, wherein the at least one inner contour edge has subsurface damage upto a depth less than or equal to about 75 μm.
 36. The glass article ofclaim 29, wherein the defect lines extend the full thickness of theedge.
 37. The glass article of claim 29, wherein a distance between thedefect lines is less than or equal to about 7 μm.
 38. The method ofclaim 1, wherein the pulsed laser produces pulse bursts with at least 2pulses per pulse burst.
 39. The method of claim 1, wherein the pulsedlaser has laser power of 10 W-150 W and produces pulse bursts with atleast 2 pulses per pulse burst.
 40. The method of claim 39, wherein thepulsed laser has laser power of 10 W-100 W and produces pulse burstswith at least 2-25 pulses per pulse burst.
 41. The method of claim 39,wherein the pulsed laser has laser power of 25 W-60 W, and producespulse bursts with at least 2-25 pulses per burst and the periodicitybetween the defect lines is 2-10 microns.
 42. The method of claim 39,wherein the pulsed laser has laser power of 10 W-100 W and the workpieceor the laser beam is translated relative to one another at a rate of atleast 0.25 m/sec.
 43. The method of claim 39, wherein (i) the pulsedlaser has laser power of 10 W-100 W; and (ii) the workpiece or the laserbeam is translated relative to one another at a rate of at least 0.4m/sec.